Products
Series Classification
Photovoltaic additives
Diamond wire cutting coolant
Cleaner
Debonding agent
Lollipop
Phosphate compound fertilizer
Wet-process phosphoric acid
Concentrated phosphoric acid
Phosphate rock reverse flotation collector
Phosphoric acid extraction defoamer
Circulating water aid agent
Scale and corrosion inhibitor
Algaecide
Oil stain cleaning agent
Defoamer
Semiconductor and Glass Plate
Wire erosion fluid
Abrasive
Cleaning agent
Padding fluid
Metalworking additives
Fully synthetic copper wire drawing fluid
Semi-synthetic copper wire drawing oil
Tinning flux
Copper wire antioxidant
Main push Products
Silicon wafer debonding agent NY-125
More details
Silicon Wafer De-bonding Agent NY-126
Silicon wafer debonding agent (NY-125/NY-126/NY-127/NY-128)
Diamond wire cutting coolant NY-426
Diamond wire cutting coolant NY-427
Diamond wire cutting coolant NY-429
This product is a new type of silicon wafer cleaner developed for cleaning silicon wafers, which can effectively reduce dirt on the surface of silicon wafers. It can efficiently and quickly remove dirt such as silicon powder, metal particles, and organic residues left on the surface of silicon wafers from wire cutting, as well as from the cutting and debonding processes. After cleaning with this product, the dirt rate on the silicon wafers is low, stability is good, the operation is simple, and the production yield is high.
This product is suitable for the cutting field of semiconductors and other optoelectronic materials, focusing on reducing static accumulation during the manufacturing process, sawdust particle contamination, and reducing pad dirt, while also improving lubrication effects. It is a non-corrosive, biodegradable, environmentally friendly product.
Non-oxidizing biocides, with a rapid killing effect. They quickly degrade into relatively non-toxic products, and their degradation occurs through rapid reactions with nucleophilic substances or organic materials in various water qualities. In foreign industries, they are applied in reverse osmosis systems for producing drinking water.
This product is a cationic surfactant, often compounded with 1227 and benzyl dimethyl octadecyl ammonium chloride, and its antibacterial effect is superior to that of isothiazolinone products. At a dosage concentration of 5 mg/L, the bactericidal rate against heterotrophic bacteria is 98.5%, against iron bacteria is 95.5%, and against sulfate-reducing bacteria is 99.9%; at a dosage concentration of 10 mg/L, the bactericidal rate against heterotrophic bacteria is 99.9%, against iron bacteria is 99.0%, and against sulfate-reducing bacteria is 99.9%; at a dosage concentration of 20 mg/L, the bactericidal rate against heterotrophic bacteria is 99.9%, against iron bacteria is 99.6%, and against sulfate-reducing bacteria is 99.9%. This product can be used as a substitute for 1227 and is suitable for disinfection of equipment in restaurants, the brewing industry, and the food industry, as well as for sterilization and algae removal in swimming pools, as a leveling agent in the dyeing and printing industry, and as an antistatic agent and softener in the paper, plastic, and textile industries.
Tin-plated flux (S-13) is a new product composed of wetting agents, emulsifiers, high-temperature antioxidants, and adhesion promoters. This product can deeply clean the oxide layer on the surface of copper wires, reduce the interfacial tension between the substrate and solder, and achieve a uniform solder coating. At the same time, it has a high antioxidant effect, which can preferentially reduce tin oxide and reduce the generation of tin dross.
This product is mainly composed of molybdate, polycarboxylic acid, and copper corrosion inhibitor, which has excellent corrosion inhibition effect on carbon steel, copper materials, and stainless steel in softened water, and also has scale inhibition effect. It is suitable for scale inhibition and corrosion inhibition in softened water closed-loop circulation systems for continuous casting crystallization cooling water, blast furnace body cooling water, and central air conditioning chilled water. It is recommended to use a concentration of 400–600 mg/L.
In the production process of wet-process phosphoric acid, the vacuum filtration system equipment and pipelines experience varying degrees of scaling and blockage. These scaling substances are mainly composed of KzSiF6, NazSiF6, and CaSO4·2H20. Particularly, phosphate ores with high potassium and sodium content exhibit severe scaling phenomena, which greatly hinder the normal production of wet-process phosphoric acid. The anti-scaling agents, solubilizers, and synergists for wet-process phosphoric acid are synthesized through specific processes, effectively resisting the formation of easily scaling substances during the filtration and delivery processes of wet-process phosphoric acid, especially the nucleation and crystal growth of KzSiF6 and NazSiF6. They can significantly loosen and reduce the adhesion of scaling substances nearby. With a certain amount of addition, they can greatly extend the continuous normal production cycle and have no adverse effects on the wet-process phosphoric acid production process and its subsequent processes, making them a very effective anti-scaling additive.
This polishing liquid can achieve a nano-level finish, effectively improving the roughness of the polished surface, making it easy to remove surface scratches, waves, and spots. The polished surface has a high mirror finish, presenting a perfect polishing effect.
