Product Introduction

　　This polishing liquid can achieve a nano-level finish, effectively improving the roughness of the polished surface, making it easy to remove surface scratches, waves, and spots. The polished surface has a high mirror finish, presenting a perfect polishing effect. It is suitable for precision polishing of sapphire glass, micro-grade glass, optical glass, optical lenses, and other applications.

Product Features

　　1.Excellent cooling effect.Timely dissipate the high heat generated between the wire saw and the wafer.

　　2.Outstanding lubrication performance.Reduce wafer surface line marks,warping TTV，Reduce surface roughness and decrease the wear of diamond wire.

　　3.Good dispersibility.Resolve the problem of re deposition of particle debris generated by cutting on the surface of steel wires and wafers,avoiding adsorption on the wafer surface and causing fouling,facilitating wafer delamination and cleaning.

　　4.Excellent chemical stability.No metal ion pollution,high temperature will not decompose,and will not cause oxidation on the surface of silicon wafers.

　　5.Outstanding defoaming and cleaning performance.It can effectively restrain the bubbles generated in the cutting process and eliminate the adverse effects of foam on the cutting process.

　　6.Environmental friendliness.Selecting raw materials that are easy to biodegrade can be achieved through conventional sewage treatment methods.

Product quality indicators

　　Appearance:Colorless or pale yellow liquid

　　Density(g/cm3,25℃):0.950-1.150

　　PH value(5‰aqueous solution,25℃):5.0~7.5

　　Surface tension(5‰aqueous solution,25℃):20~32

　　COD(original solution,mg/L）：≤200000

　　Water solubility:miscible with water in any proportion