Products
Series Classification
Photovoltaic additives
Diamond wire cutting coolant
Cleaner
Debonding agent
Lollipop
Phosphate compound fertilizer
Wet-process phosphoric acid
Concentrated phosphoric acid
Phosphate rock reverse flotation collector
Phosphoric acid extraction defoamer
Circulating water aid agent
Scale and corrosion inhibitor
Algaecide
Oil stain cleaning agent
Defoamer
Semiconductor and Glass Plate
Wire erosion fluid
Abrasive
Cleaning agent
Padding fluid
Metalworking additives
Fully synthetic copper wire drawing fluid
Semi-synthetic copper wire drawing oil
Tinning flux
Copper wire antioxidant
Main push Products
Silicon wafer debonding agent NY-125
More details
Silicon Wafer De-bonding Agent NY-126
Silicon wafer debonding agent (NY-125/NY-126/NY-127/NY-128)
Diamond wire cutting coolant NY-426
Diamond wire cutting coolant NY-427
Diamond wire cutting coolant NY-429
Add 1-3% polishing agent by volume in the dosing tank, maintaining a temperature of 70°C, and replenish 1.5 mL for each batch according to the volume of the dosing tank. The amount of polishing agent can be adjusted based on on-site usage.
This product is a special coolant for a large circulation system mainly used for multi-wire cutting of photovoltaic monocrystalline silicon wafers. The product has a high effective ingredient content (high COD type), strong synergistic effects between components, and excellent functions such as cooling, lubrication, wetting, dispersion, defoaming, and cleaning. It is suitable for cutting large-size silicon wafers, fine wire diameter diamond wires, and thin silicon wafers. NY-426 is suitable for the overflow mode cutting system of high COD enriched recycling water circulation systems, while NY-428/NY-205 is suitable for the closed cylinder mode cutting system of high COD enriched recycling water. It significantly reduces pure water consumption by over 90%, and the single consumption of cutting fluid can be reduced by more than 30%.
This product is a high-performance pure water single-cylinder coolant mainly used for multi-wire cutting of photovoltaic solar monocrystalline silicon wafers. It has extremely excellent dynamic surface tension and outstanding liquid cooling effect, suitable for cutting large Size silicon wafers, fine wire diameter diamond wires, and thin silicon wafers.
This product is suitable for single-component cooling fluids used in the diamond wire cutting of hard and brittle materials such as photovoltaic solar monocrystalline/multicrystalline silicon wafers, silicon wafers, gallium arsenide, and quartz. This product has excellent cooling, lubrication, wetting, dispersion, and defoaming functions. During use, it has advantages such as low diamond wire breakage rate, small cutting line bow, and low cutting rate. The processed materials have high yield rates, low TTV averages, low line scratch values, and fewer edge chipping rates, making it a product with excellent performance and high cost-effectiveness that is environmentally friendly.
This product is a single-component coolant mainly used for the diamond wire cutting of monocrystalline and polycrystalline silicon wafers in photovoltaic solar energy applications. This product has excellent liquid cooling effects, super strong silicon powder dispersion performance, outstanding lubrication effects, excellent wetting and penetration performance, and remarkable foam control in the cylinder. It is particularly suitable for pure water systems and low COD concentration enriched recycling cutting of large size silicon wafers, fine diameter diamond wires, and thin silicon wafers. The cutting process has low equipment torque load and high yield rate, making it an environmentally friendly product that provides excellent cost performance for customers.
This product is a high-performance cooling liquid mainly used for cutting large-size monocrystalline silicon wafers with diamond wire in photovoltaic solar applications. It has extremely excellent dynamic surface tension, outstanding liquid cooling effect, excellent extreme pressure lubrication capability, super strong silicon powder dispersion performance, and remarkable foam control in the cylinder. It is particularly suitable for cutting large-size silicon wafers, fine diameter diamond wires, and thin silicon wafers in a pure water system, with good control of breakage rates and extremely low cutting rates and wire jamming rates, resulting in a high yield rate. The small indicator data such as line marks, TTV, thickness variation, and edge chipping are excellent, effectively reducing the equipment load during the cutting process, and making a significant contribution to increasing production, enhancing efficiency, and reducing costs for customers as an environmentally friendly product.
This product is developed for cleaning monocrystalline silicon wafers cut by diamond wire (also suitable for cleaning polycrystalline wafers). It is divided into two components, A and B, and through an optimized formula, it has a stronger ability to clean various contaminants on the surface of silicon wafers, improving tolerance to contaminants before cleaning. It has a better ability to remove residual trace contaminants in the damage layer of the silicon wafer and in the wire seam, significantly reducing issues such as back-end texturing white spots. The surface of the cleaned silicon wafer is clean, with consistent color, and its brightness and cleanliness are superior to conventional cleaning agents. It also has advantages such as low foam, stable pH value, and easy rinsing, which is beneficial for subsequent texturing processes.
This product is mainly used for the texturing production of monocrystalline silicon wafers cut by diamond wire, featuring good cleaning and texturing effects, low consumption, effective control of corrosion rate and amount, uniform pyramid structure, low reflectivity, wide process window, and does not contain low-carbon alcohols that are volatile and toxic.
This product is used in the splicing process of solar monocrystalline/multicrystalline silicon rods, for the splicing between silicon rods, reducing issues such as cracks, grinding marks, and knife jams that occur during machining. It has strong process adaptability and good debonding effects, making the recovery of edge scraps simpler and more convenient, while avoiding the breakage issues caused by high and low rods during slicing.
