Products
Series Classification
Photovoltaic additives
Diamond wire cutting coolant
Cleaner
Debonding agent
Lollipop
Phosphate compound fertilizer
Wet-process phosphoric acid
Concentrated phosphoric acid
Phosphate rock reverse flotation collector
Phosphoric acid extraction defoamer
Circulating water aid agent
Scale and corrosion inhibitor
Algaecide
Oil stain cleaning agent
Defoamer
Semiconductor and Glass Plate
Wire erosion fluid
Abrasive
Cleaning agent
Padding fluid
Metalworking additives
Fully synthetic copper wire drawing fluid
Semi-synthetic copper wire drawing oil
Tinning flux
Copper wire antioxidant
Main push Products
Silicon wafer debonding agent NY-125
More details
Silicon Wafer De-bonding Agent NY-126
Silicon wafer debonding agent (NY-125/NY-126/NY-127/NY-128)
Diamond wire cutting coolant NY-426
Diamond wire cutting coolant NY-427
Diamond wire cutting coolant NY-429
This product is used for cleaning sapphire glass, microcrystalline glass, optical glass, optical lenses, etc., effectively removing various impurities from the glass surface, resulting in a high surface smoothness after cleaning.
This product is suitable for the cutting field of semiconductors and other optoelectronic materials, focusing on reducing static accumulation during the manufacturing process, sawdust particle contamination, and reducing pad dirt, while also improving lubrication effects. It is a non-corrosive, biodegradable, environmentally friendly product.
