Product Introduction

　　This product is a new type of silicon wafer cleaner developed for silicon wafer cleaning, which can effectively reduce surface contamination on silicon wafers. It can efficiently and quickly remove contaminants such as silicon powder, metal particles, and organic residues left on the surface of silicon wafers from wire cutting and debonding processes. After cleaning with this product, the contamination rate of silicon wafers is low, stability is good, operation is simple, and production yield is high.

Product Features

　　◎ Excellent cleaning effect, low contamination rate of silicon wafers

　　◎ Stable pH value of the cleaning solution, long effective period of the agent

　　◎ Strong penetration ability, quickly removes deep-seated contaminants on the surface of silicon wafers

　　◎ Low foam, easy to rinse, no residue

　　◎ Convenient to use, good stability

　　◎ Excellent biodegradability, environmentally friendly

Quality Indicators

For more information, please refer to the product technical data sheet (TDS)

Usage Instructions

　　Determine the cleaning process and the amount of cleaner based on the site conditions, add SC-2022 silicon wafer cleaner to the cleaning tank in proportion, and start cleaning after fully stirring evenly.

Storage and Packaging

　　◎ The shelf life of this product is twelve months;

　　◎ Store sealed in a cool, dry place;

　　◎ Packaged in 25kg, 200kg, 1000kg barrels or as per customer requirements.