Products
Series Classification
Photovoltaic additives
Diamond wire cutting coolant
Cleaner
Debonding agent
Lollipop
Phosphate compound fertilizer
Wet-process phosphoric acid
Concentrated phosphoric acid
Phosphate rock reverse flotation collector
Phosphoric acid extraction defoamer
Circulating water aid agent
Scale and corrosion inhibitor
Algaecide
Oil stain cleaning agent
Defoamer
Semiconductor and Glass Plate
Wire erosion fluid
Abrasive
Cleaning agent
Padding fluid
Metalworking additives
Fully synthetic copper wire drawing fluid
Semi-synthetic copper wire drawing oil
Tinning flux
Copper wire antioxidant
Main push Products
Silicon wafer debonding agent NY-125
More details
Silicon Wafer De-bonding Agent NY-126
Silicon wafer debonding agent (NY-125/NY-126/NY-127/NY-128)
Diamond wire cutting coolant NY-426
Diamond wire cutting coolant NY-427
Diamond wire cutting coolant NY-429
This product is used in the splicing process of solar monocrystalline/multicrystalline silicon rods, for the splicing between silicon rods, reducing issues such as cracks, grinding marks, and dull blades that occur during machining. It has strong process applicability and good debonding effects, making the recovery of edge scraps simpler and more convenient.
This product is mainly composed of organic acids, corrosion inhibitors, surfactants, etc. Its cleaning effect is significant, with a low corrosion rate, and it is not prone to hydrogen embrittlement. This product can be used for non-stop cleaning of circulating water systems, with a dosage concentration of 0.1 to 0.5%. Cleaning for about 15 hours can remove iron oxide and carbonate from the heat exchanger. This product can also be used for cleaning single equipment, with a dosage concentration of 10 to 15%, and the cleaning time only takes about 10 hours. The descaling rate for both methods is greater than 95%.
Semi-synthetic copper wire drawing oil (SCU-02) is formulated from various high-quality lubricating additives, extreme pressure additives, and base oils. It is suitable for the medium drawing, small drawing, and fine drawing processes of copper wire, as well as for the multi-mode continuous stretching forming, cutting processing, and rapid punching and shearing of copper plates.
This product has an extremely excellent separation effect on single/double component adhesives between silicon wafers and cutting resin boards, and can be effectively used for various bonding adhesives currently applied in the solar cutting industry. It is safe and convenient to operate, non-flammable, and poses no harm to the human body.
This product is suitable for the de-bonding process after the multi-wire cutting of hard and brittle materials with diamond wire. It has an extremely excellent separation effect on the two-component adhesive bonding between silicon wafers and plastic plates, especially suitable for the use of various adhesives in the multi-wire cutting of solar photovoltaic silicon wafers and semiconductor materials. It is safe and convenient to operate, non-flammable, and poses little harm to human health.
This product is suitable for cleaning native polycrystalline, head and tail materials, edge materials, fragments, etc. It can effectively remove surface metal ions, organic residue, oxidation, and other dirt, eliminating the impact on the crystal furnace. The cleaned silicon material has the advantages of a clean surface, consistent color, and easy rinsing.
This product is synthesized using modified polymethylsiloxane, emulsifiers, dispersants, etc., through special processes. This product has a wide range of applications and does not react with substances in the foaming system.
