Products
Series Classification
Photovoltaic additives
Diamond wire cutting coolant
Cleaner
Debonding agent
Lollipop
Phosphate compound fertilizer
Wet-process phosphoric acid
Concentrated phosphoric acid
Phosphate rock reverse flotation collector
Phosphoric acid extraction defoamer
Circulating water aid agent
Scale and corrosion inhibitor
Algaecide
Oil stain cleaning agent
Defoamer
Semiconductor and Glass Plate
Wire erosion fluid
Abrasive
Cleaning agent
Padding fluid
Metalworking additives
Fully synthetic copper wire drawing fluid
Semi-synthetic copper wire drawing oil
Tinning flux
Copper wire antioxidant
Main push Products
Silicon wafer debonding agent NY-125
More details
Silicon Wafer De-bonding Agent NY-126
Silicon wafer debonding agent (NY-125/NY-126/NY-127/NY-128)
Diamond wire cutting coolant NY-426
Diamond wire cutting coolant NY-427
Diamond wire cutting coolant NY-429
This product is developed for cleaning monocrystalline silicon wafers cut by diamond wire (also suitable for cleaning polycrystalline wafers). It is divided into two components, A and B, and through an optimized formula, it has a stronger ability to clean various contaminants on the surface of silicon wafers, improving tolerance to contaminants before cleaning. It has a better ability to remove residual trace contaminants in the damage layer of the silicon wafer and in the wire seam, significantly reducing issues such as back-end texturing white spots. The surface of the cleaned silicon wafer is clean, with consistent color, and its brightness and cleanliness are superior to conventional cleaning agents. It also has advantages such as low foam, stable pH value, and easy rinsing, which is beneficial for subsequent texturing processes.
This product is suitable for cleaning native polycrystalline, head and tail materials, edge materials, fragments, etc. It can effectively remove surface metal ions, organic residue, oxidation, and other dirt, eliminating the impact on the crystal furnace. The cleaned silicon material has the advantages of a clean surface, consistent color, and easy rinsing.
This product is a new type of silicon wafer cleaner developed for cleaning silicon wafers, which can effectively reduce dirt on the surface of silicon wafers. It can efficiently and quickly remove dirt such as silicon powder, metal particles, and organic residues left on the surface of silicon wafers from wire cutting, as well as from the cutting and debonding processes. After cleaning with this product, the dirt rate on the silicon wafers is low, stability is good, the operation is simple, and the production yield is high.
