Product Introduction

　　This product is a high-performance cooling liquid mainly used for cutting large-size monocrystalline silicon wafers with diamond wire in photovoltaic solar applications. It has extremely excellent dynamic surface tension, excellent liquid cooling effect, outstanding extreme pressure lubrication capability, super strong silicon powder dispersion performance, and outstanding foam control in the cylinder. It is particularly suitable for cutting large-size silicon wafers, fine diameter diamond wires, and thin silicon wafers in a pure water system, with good control of breakage rates, extremely low cutting rates, and wire jamming rates, resulting in a high yield rate. The small indicator data such as line marks, TTV, thickness variation, and edge chipping are excellent, effectively reducing the equipment load during the cutting process, and making a significant contribution to increasing production, improving efficiency, and reducing costs for customers as an environmentally friendly product.

Product Features

　　◎ Excellent cooling effect

　　◎ Outstanding extreme pressure lubrication performance

　　◎ Good silicon powder dispersion performance

　　◎ Excellent dynamic wetting performance

　　◎ Excellent chemical stability

　　◎ Superior compatibility with pure water

　　◎ Outstanding foam control performance

　　◎ Environmental friendliness

Quality Indicators

For more information, please refer to the product technical data sheet (TDS)

Storage and Packaging

　　◎This product is non-toxic and non-hazardous, with a shelf life of twelve months;

　　◎Store sealed in a ventilated, cool, and dry place; 

　　◎1kg plastic bottle, 25kg, 200kg, 1000kg barrel packaging or as per customer requirements.