Product Introduction

　　This product is suitable for the cutting field of semiconductors and other optoelectronic materials, focusing on reducing static accumulation during the manufacturing process, sawdust particle contamination, reducing pad dirt, and improving lubrication effects. It is a non-corrosive, biodegradable, environmentally friendly product.

Product Features

　　1) Accelerates heat transfer speed, reduces thermal stress, thus increasing slicing speed;

　　2) Effectively reduces water surface tension to 28~33 mN/m;

　　3) Significant wetting performance, excellent cleaning effect;

　　4) Improves the cutting quality of the wafer, reduces surface residue adhesion;

　　5) Increases the yield and pass rate of the wafer, prevents particle adhesion caused by electrostatic discharge;

　　6) Free of inorganic salts;

　　7) Blade life extended by 20%-30% (varies depending on different site usage conditions);

　　8) Non-hazardous, easily biodegradable.