
Silicon wafer debonding agent NY-125
Classification:
Product Details
Product Introduction
This product has extremely excellent separation effects on single/double component adhesives between silicon wafers and cutting resin boards, and can be effectively used for various bonding adhesives currently applied in the solar cutting industry. It is safe and convenient to operate, non-flammable, and poses no harm to the human body.
Product Features
◎ Safe and convenient
◎ Strong adaptability to adhesives
◎ Extremely excellent debonding efficiency
◎ Excellent ability to remove silicon powder debris
◎ Good pre-cleaning effect
◎ Facilitates the insertion operation of silicon wafers, significantly reducing the occurrence of stacking and broken pieces during the insertion process.
Quality Indicators
Appearance |
Yellow or dark brown liquid |
Density (g/cm3, 25℃) |
1.000~1.220 |
pH value (25℃) |
3.0 |
Water Solubility |
Miscible with water in any proportion |
For more information, please refer to the product technical data sheet (TDS).
Storage and Packaging
◎ The shelf life of this product is twelve months;
◎ Store in a sealed container in a cool, dry place;
◎ Available in 25kg, 200kg, 1000kg barrel packaging or as per customer requirements.
Keyword:
Degummy agent for silicon wafer
excellent
silicon
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