Products
Series Classification
Photovoltaic additives
Diamond wire cutting coolant
Cleaner
Debonding agent
Lollipop
Phosphate compound fertilizer
Wet-process phosphoric acid
Concentrated phosphoric acid
Phosphate rock reverse flotation collector
Phosphoric acid extraction defoamer
Circulating water aid agent
Scale and corrosion inhibitor
Algaecide
Oil stain cleaning agent
Defoamer
Semiconductor and Glass Plate
Wire erosion fluid
Abrasive
Cleaning agent
Padding fluid
Metalworking additives
Fully synthetic copper wire drawing fluid
Semi-synthetic copper wire drawing oil
Tinning flux
Copper wire antioxidant
Main push Products
Silicon wafer debonding agent NY-125
More details
Silicon Wafer De-bonding Agent NY-126
Silicon wafer debonding agent (NY-125/NY-126/NY-127/NY-128)
Diamond wire cutting coolant NY-426
Diamond wire cutting coolant NY-427
Diamond wire cutting coolant NY-429
Copper wire antioxidant (S-14) is a product composed of dynamic wetting agents, water-repellent agents, corrosion inhibitors, adhesion promoters, and antioxidants. This product has good dehydration ability, excellent anti-corrosion and rust resistance performance. After contact immersion treatment, it can form a dense monomolecular protective film on the copper surface, effectively isolating air and preventing corrosion and discoloration of the copper surface.
Fully synthetic copper wire drawing fluid (SCU-01) is a new type of water-based drawing fluid suitable for ultra-fine copper wire micro-drawing plastic processing. This product has excellent extreme pressure lubrication performance, strong chemical reaction stability, outstanding corrosion inhibition performance, which can greatly reduce the possibility of chemical reactions with metals or metal salts, durable continuous use performance, convenient operation, and high overall cost-effectiveness, making it a low-carbon, economical, and environmentally friendly product.
Semi-synthetic copper wire drawing oil (SCU-02) is formulated from various high-quality lubricating additives, extreme pressure additives, and base oils. It is suitable for the medium drawing, small drawing, and fine drawing processes of copper wire, as well as for the multi-mode continuous stretching forming, cutting processing, and rapid punching and shearing of copper plates.
Tin-plated flux (S-13) is a new product composed of wetting agents, emulsifiers, high-temperature antioxidants, and adhesion promoters. This product can deeply clean the oxide layer on the surface of copper wires, reduce the interfacial tension between the substrate and solder, and achieve a uniform solder coating. At the same time, it has a high antioxidant effect, which can preferentially reduce tin oxide and reduce the generation of tin dross.
