
Tin-plated flux
Classification:
Product Details
Product Introduction
The tinning flux (S-13) is a new product composed of wetting penetrants, emulsifiers, high-temperature antioxidants, and adhesion promoters. This product can deeply clean the oxide layer on the surface of copper wires, reduce the interfacial tension between the substrate and solder, achieve a uniform solder coating, and has a high antioxidant effect, which can preferentially reduce tin oxide and reduce the generation of tin dross.
Product Characteristics
◎ Excellent cleaning ability for the oxide layer on the substrate surface
◎ Outstanding interfacial tension reduction performance
◎ Enhanced solder wetting and spreading effect
◎ Strong reduction capability
◎ No residue on the welding surface, no cleaning required after welding
Quality Indicators
Test Item Name |
Test Item Unit |
Testing Standards |
Appearance |
- |
Colorless or light yellow liquid |
Density |
kg/m³, 20+1°C |
1.10~1.20 |
pH Value |
5% Distilled Water Solution |
2.0~4.0 |
Surface Tension |
mN/m, 25+1°C |
<35 |
For more information, please refer to the product technical data sheet (TDS)
Storage and Packaging
◎ The shelf life of this product is twelve months from the date of production;
◎ Store sealed in a ventilated, constant temperature, dry place below 20°C;
◎ Packaged in 25kg, 200kg, or 1000kg barrels, or according to customer requirements.
Keyword:
Metalworking additives
surface
solder
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