Products
Series Classification
Photovoltaic additives
Diamond wire cutting coolant
Cleaner
Debonding agent
Lollipop
Phosphate compound fertilizer
Wet-process phosphoric acid
Concentrated phosphoric acid
Phosphate rock reverse flotation collector
Phosphoric acid extraction defoamer
Circulating water aid agent
Scale and corrosion inhibitor
Algaecide
Oil stain cleaning agent
Defoamer
Semiconductor and Glass Plate
Wire erosion fluid
Abrasive
Cleaning agent
Padding fluid
Metalworking additives
Fully synthetic copper wire drawing fluid
Semi-synthetic copper wire drawing oil
Tinning flux
Copper wire antioxidant
Main push Products
Silicon wafer debonding agent NY-125
More details
Silicon Wafer De-bonding Agent NY-126
Silicon wafer debonding agent (NY-125/NY-126/NY-127/NY-128)
Diamond wire cutting coolant NY-426
Diamond wire cutting coolant NY-427
Diamond wire cutting coolant NY-429
Add 1-3% polishing agent by volume in the dosing tank, maintaining a temperature of 70°C, and replenish 1.5 mL for each batch according to the volume of the dosing tank. The amount of polishing agent can be adjusted based on on-site usage.
This product is mainly used for the texturing production of monocrystalline silicon wafers cut by diamond wire, featuring good cleaning and texturing effects, low consumption, effective control of corrosion rate and amount, uniform pyramid structure, low reflectivity, wide process window, and does not contain low-carbon alcohols that are volatile and toxic.
This product is used in the splicing process of solar monocrystalline/multicrystalline silicon rods, for the splicing between silicon rods, reducing issues such as cracks, grinding marks, and knife jams that occur during machining. It has strong process adaptability and good debonding effects, making the recovery of edge scraps simpler and more convenient, while avoiding the breakage issues caused by high and low rods during slicing.
This product is used in the splicing process of solar monocrystalline/multicrystalline silicon rods, for the splicing between silicon rods, reducing issues such as cracks, grinding marks, and dull blades that occur during machining. It has strong process applicability and good debonding effects, making the recovery of edge scraps simpler and more convenient.
