Silicon Wafer De-bonding Agent NY-126

Silicon Wafer De-bonding Agent NY-126


This product has an extremely excellent separation effect on single/double component adhesives between silicon wafers and cutting resin boards, and can be effectively used for various bonding adhesives currently applied in the solar cutting industry. It is safe and convenient to operate, non-flammable, and poses no harm to the human body.

Classification:


Product Details

Product Introduction

  This product has extremely excellent separation effects on single/double component adhesives between silicon wafers and cutting resin boards, and can be effectively used for various bonding adhesives currently applied in the solar cutting industry. It is safe and convenient to operate, non-flammable, and poses no harm to the human body.

 

Product Features

  ◎ Safe and convenient

  ◎ Strong adaptability to adhesives

  ◎ Extremely excellent debonding efficiency

  ◎ Excellent ability to discharge silicon powder debris

  ◎ Good pre-cleaning effect

  ◎ Facilitates the insertion operation of silicon wafers, significantly reducing the occurrence of stacking and broken pieces during the insertion process.

 

Quality Indicators

Appearance

Yellow or dark brown liquid

Density (g/cm3, 25℃)

1.120~1.320

pH Value (25℃)

<3.0

Water Solubility

Miscible with water in any proportion

For more information, please refer to the product technical data sheet (TDS).

 

 

Storage and Packaging

  ◎ The shelf life of this product is twelve months;

  ◎ Store sealed in a cool, dry place;

  ◎ Packaged in 25kg, 200kg, 1000kg barrels or as per customer requirements.

Keyword:

Degummy agent for silicon wafer

excellent

silicon

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Chen Zihan

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Li Tingting

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