Products
Series Classification
Photovoltaic additives
Diamond wire cutting coolant
Cleaner
Debonding agent
Lollipop
Phosphate compound fertilizer
Wet-process phosphoric acid
Concentrated phosphoric acid
Phosphate rock reverse flotation collector
Phosphoric acid extraction defoamer
Circulating water aid agent
Scale and corrosion inhibitor
Algaecide
Oil stain cleaning agent
Defoamer
Semiconductor and Glass Plate
Wire erosion fluid
Abrasive
Cleaning agent
Padding fluid
Metalworking additives
Fully synthetic copper wire drawing fluid
Semi-synthetic copper wire drawing oil
Tinning flux
Copper wire antioxidant
Main push Products
Silicon wafer debonding agent NY-125
More details
Silicon Wafer De-bonding Agent NY-126
Silicon wafer debonding agent (NY-125/NY-126/NY-127/NY-128)
Diamond wire cutting coolant NY-426
Diamond wire cutting coolant NY-427
Diamond wire cutting coolant NY-429
This product is developed for cleaning monocrystalline silicon wafers cut by diamond wire (also suitable for cleaning polycrystalline wafers). It is divided into two components, A and B, and through an optimized formula, it has a stronger ability to clean various contaminants on the surface of silicon wafers, improving tolerance to contaminants before cleaning. It has a better ability to remove residual trace contaminants in the damage layer of the silicon wafer and in the wire seam, significantly reducing issues such as back-end texturing white spots. The surface of the cleaned silicon wafer is clean, with consistent color, and its brightness and cleanliness are superior to conventional cleaning agents. It also has advantages such as low foam, stable pH value, and easy rinsing, which is beneficial for subsequent texturing processes.
This product is a fully organic alkaline formulation composed of phosphonic poly maleic anhydride, organic phosphonic acid, and corrosion inhibitors. It is resistant to high temperatures, with a characteristic of not decomposing at 250℃. In circulating water with carbonate hardness of 100 to 600 mg/L (calculated as CaCO3), the corrosion rate of A3 carbon steel is less than -40.10 mm/a, and the fouling thermal resistance value is less than 2.0×10 m2·K/W. This product is widely used in industrial circulating water in fertilizer plants, chemical plants, refineries, steel mills, oxygen generators, central air conditioning systems, and in oilfield water injection for scale inhibition and corrosion prevention. The recommended dosage concentration is 30 to 35 mg/L.
Fully synthetic copper wire drawing fluid (SCU-01) is a new type of water-based drawing fluid suitable for ultra-fine copper wire micro-drawing plastic processing. This product has excellent extreme pressure lubrication performance, strong chemical reaction stability, outstanding corrosion inhibition performance, which can greatly reduce the possibility of chemical reactions with metals or metal salts, durable continuous use performance, convenient operation, and high overall cost-effectiveness, making it a low-carbon, economical, and environmentally friendly product.
This product is suitable for the grinding field of semiconductors and other optoelectronic materials. It focuses on reducing thermal stress during the manufacturing process, enhancing the suspension and dispersion effect of abrasives, lowering the friction coefficient during grinding, effectively avoiding frosting white spots during the grinding process, reducing contamination rates, improving grinding quality and flattening efficiency, and is an environmentally friendly product with very low foam, non-corrosive, and biodegradable.
This product is composed of organic polyphosphonic acid, polyfunctional polymers, and additives, belonging to a fully organic alkaline formulation. It has scale inhibition, dispersion, and corrosion inhibition properties, outperforming other fully organic formulations, with a recommended dosage concentration of 30-40 mg/L. It is suitable for industrial circulating water with high hardness and high alkalinity, and does not require acid to adjust the pH value.
This product is a scale inhibitor and corrosion inhibitor specially designed for low hardness water in South China. This product is non-toxic and will not cause secondary pollution to water bodies. It is mainly applied to circulating water with 2+Ca (calculated as CaCO3) less than 50mg/L, with a dosage concentration of 50-80mg/L, resulting in a corrosion rate of carbon steel less than 0.1mm/a and a fouling attachment amount of less than 15MCM.
This product is mainly used for the texturing production of monocrystalline silicon wafers cut by diamond wire, featuring good cleaning and texturing effects, low consumption, effective control of corrosion rate and amount, uniform pyramid structure, low reflectivity, wide process window, and does not contain low-carbon alcohols that are volatile and toxic.
This product is mainly composed of non-ionic surfactants and additives, with strong emulsifying, penetrating, and oil removal effects. It is non-corrosive to metal equipment. It is mainly used for degreasing and cleaning treatment in circulating cooling water systems; it can also be used as an oil removal and cleaning agent in the event of oil leakage in the circulating water system of refineries.
This product is a new type of corrosion inhibitor specially developed for oil field water injection, suitable for scale inhibition and corrosion prevention in water injection pipelines with high mineralization and high chloride ions. The corrosion inhibition rate for carbon steel reaches 95%, and the scale inhibition rate reaches 98%, with no pollution to the environment.
