Product Introduction

　　This product is suitable for the grinding field of semiconductors and other optoelectronic materials. It focuses on reducing thermal stress during the manufacturing process, enhancing the suspension and dispersion effect of abrasives, lowering the friction coefficient during grinding, effectively avoiding frosting white spots during the grinding process, reducing contamination rates, improving grinding quality and flattening efficiency, with extremely low foam, non-corrosive, and biodegradable, making it an environmentally friendly product.

Product Features

　　1) Excellent cooling effect, significantly reducing thermal stress at the grinding interface;

　　2) Good abrasive suspension and dispersion ability, improving grinding quality and efficiency;

　　3) Excellent lubrication effect, effectively controlling the scratch and abrasion rates on the surface of the grinding products.

　　4) Strong protection effect on the surface of the grinding products, effectively avoiding the appearance of white spots during the grinding process;

　　5) Easy to clean, low residue, effectively reducing contamination rates;

　　6) Excellent foam control ability:

　　7) Non-hazardous, easily biodegradable.