Product Introduction

　　This product is developed for cleaning monocrystalline silicon wafers cut by diamond wire (also suitable for cleaning polycrystalline silicon wafers). It is divided into two components, A and B, and through an optimized formula, it has a stronger ability to clean various contaminants on the surface of silicon wafers, improving tolerance to contaminants before cleaning. It has better removal capability for the damage layer of silicon wafers and residual trace contaminants in the wire seam, significantly reducing issues such as back-end texturing white spots. The surface of the cleaned silicon wafers is clean, with consistent color, brightness, and cleanliness superior to conventional cleaning agents. It also has advantages such as low foam, stable pH value, and easy rinsing, which is beneficial for subsequent texturing processes.

Product Features

　　◎ Excellent cleaning effect, extremely low texturing white spot rate

　　◎ Stable pH value of the cleaning solution, strong penetration and dispersion ability

　　◎ High cleaning efficiency, quickly stripping deep contaminants from the silicon wafer surface

　　◎ Consistent color, high brightness and cleanliness

　　◎ Low foam, easy rinsing, no residue

　　◎ Excellent biodegradability, environmentally friendly

Quality Indicators

For more information, please refer to the product technical data sheet (TDS).

Usage Instructions

　　Determine the cleaning process and the amount of cleaning agent based on the site conditions. Add SC-2032A/B silicon wafer cleaning agent to the cleaning tank in a ratio of A:B=2:1, stir thoroughly, and then start cleaning.

Storage and Packaging

　　◎ The shelf life of this product is twelve months;

　　◎ Store sealed in a cool, dry place;

　　◎ Available in 25kg, 200kg, 1000kg barrel packaging or as per customer requirements.