High Hardness Water Scale Inhibitor and Corrosion Inhibitor (V421)

This product is composed of organic polyphosphonic acid, polyfunctional polymers, and additives, belonging to a fully organic alkaline formulation. It has scale inhibition, dispersion, and corrosion inhibition properties, outperforming other fully organic formulations, with a recommended dosage concentration of 30-40 mg/L. It is suitable for industrial circulating water with high hardness and high alkalinity, and does not require acid to adjust the pH value.

Classification:

Circulating water aid agent

+860713-5319769

Product Inquiry

WeChat

Official WeChat

Product Details

Performance and Applications

　　This product is composed of organic polyphosphonic acid, polyphosphate, and additives, belonging to a fully organic alkaline formula. It has both scale inhibition, dispersion, and corrosion inhibition properties, with performance superior to other fully organic formulas, and can be added at a concentration of 30-40 mg/L. It is suitable for industrial circulating water with high hardness and high alkalinity, and does not require acid to adjust the pH value.

Quality Indicators

Appearance	Colorless or light yellow liquid
Solid Content (%)	>=30.0
pH Value (1% Aqueous Solution)	3.0±1.5
Density (20℃, g/cm3)	1.20±0.05

Packaging and Storage

　　◎25kg plastic drum

　　◎Store in a ventilated, dry, and cool place.

　　◎The shelf life is six months.

Keyword:

Circulating water aid agent

high

acid

Previous： Efficient scale inhibitor and corrosion inhibitor (V420)

Next: Low Hardness Water Scale Inhibitor and Corrosion Inhibitor (V422)

Related Product

Silicon wafer debonding agent NY-125

This product has an extremely excellent separation effect on single/double component adhesives between silicon wafers and cutting resin boards, and can be effectively used for various bonding adhesives currently applied in the solar cutting industry. It is safe and convenient to operate, non-flammable, and poses no harm to the human body.

Silicon Wafer De-bonding Agent NY-126

Silicon wafer debonding agent (NY-125/NY-126/NY-127/NY-128)

This product is suitable for the de-bonding process after the multi-wire cutting of hard and brittle materials with diamond wire. It has an extremely excellent separation effect on the two-component adhesive bonding between silicon wafers and plastic plates, especially suitable for the use of various adhesives in the multi-wire cutting of solar photovoltaic silicon wafers and semiconductor materials. It is safe and convenient to operate, non-flammable, and poses little harm to human health.

Diamond wire cutting coolant NY-426

This product is suitable for single-component cooling fluids used in the diamond wire cutting of hard and brittle materials such as photovoltaic solar monocrystalline/multicrystalline silicon wafers, silicon wafers, gallium arsenide, and quartz. This product has excellent cooling, lubrication, wetting, dispersion, and defoaming functions. During use, it has advantages such as low diamond wire breakage rate, small cutting line bow, and low cutting rate. The processed materials have high yield rates, low TTV averages, low line scratch values, and fewer edge chipping rates, making it a product with excellent performance and high cost-effectiveness that is environmentally friendly.

Diamond wire cutting coolant NY-427

This product is a single-component coolant mainly used for the diamond wire cutting of monocrystalline and polycrystalline silicon wafers in photovoltaic solar energy applications. This product has excellent liquid cooling effects, super strong silicon powder dispersion performance, outstanding lubrication effects, excellent wetting and penetration performance, and remarkable foam control in the cylinder. It is particularly suitable for pure water systems and low COD concentration enriched recycling cutting of large size silicon wafers, fine diameter diamond wires, and thin silicon wafers. The cutting process has low equipment torque load and high yield rate, making it an environmentally friendly product that provides excellent cost performance for customers.

Diamond wire cutting coolant NY-429

This product is a high-performance cooling liquid mainly used for cutting large-size monocrystalline silicon wafers with diamond wire in photovoltaic solar applications. It has extremely excellent dynamic surface tension, outstanding liquid cooling effect, excellent extreme pressure lubrication capability, super strong silicon powder dispersion performance, and remarkable foam control in the cylinder. It is particularly suitable for cutting large-size silicon wafers, fine diameter diamond wires, and thin silicon wafers in a pure water system, with good control of breakage rates and extremely low cutting rates and wire jamming rates, resulting in a high yield rate. The small indicator data such as line marks, TTV, thickness variation, and edge chipping are excellent, effectively reducing the equipment load during the cutting process, and making a significant contribution to increasing production, enhancing efficiency, and reducing costs for customers as an environmentally friendly product.

Diamond wire cutting coolant (High C circulating fluid NY-426/NY-428/NY-205)

This product is a special coolant for a large circulation system mainly used for multi-wire cutting of photovoltaic monocrystalline silicon wafers. The product has a high effective ingredient content (high COD type), strong synergistic effects between components, and excellent functions such as cooling, lubrication, wetting, dispersion, defoaming, and cleaning. It is suitable for cutting large-size silicon wafers, fine wire diameter diamond wires, and thin silicon wafers. NY-426 is suitable for the overflow mode cutting system of high COD enriched recycling water circulation systems, while NY-428/NY-205 is suitable for the closed cylinder mode cutting system of high COD enriched recycling water. It significantly reduces pure water consumption by over 90%, and the single consumption of cutting fluid can be reduced by more than 30%.

Diamond wire cutting coolant (pure water single cylinder liquid NY-427/NY-429)

This product is a high-performance pure water single-cylinder coolant mainly used for multi-wire cutting of photovoltaic solar monocrystalline silicon wafers. It has extremely excellent dynamic surface tension and outstanding liquid cooling effect, suitable for cutting large Size silicon wafers, fine wire diameter diamond wires, and thin silicon wafers.

Single Component Silicon Wafer Cleaner SC-2022

This product is a new type of silicon wafer cleaner developed for cleaning silicon wafers, which can effectively reduce dirt on the surface of silicon wafers. It can efficiently and quickly remove dirt such as silicon powder, metal particles, and organic residues left on the surface of silicon wafers from wire cutting, as well as from the cutting and debonding processes. After cleaning with this product, the dirt rate on the silicon wafers is low, stability is good, the operation is simple, and the production yield is high.

Dual-component silicon wafer cleaner SC-2032(A/B)

This product is developed for cleaning monocrystalline silicon wafers cut by diamond wire (also suitable for cleaning polycrystalline wafers). It is divided into two components, A and B, and through an optimized formula, it has a stronger ability to clean various contaminants on the surface of silicon wafers, improving tolerance to contaminants before cleaning. It has a better ability to remove residual trace contaminants in the damage layer of the silicon wafer and in the wire seam, significantly reducing issues such as back-end texturing white spots. The surface of the cleaned silicon wafer is clean, with consistent color, and its brightness and cleanliness are superior to conventional cleaning agents. It also has advantages such as low foam, stable pH value, and easy rinsing, which is beneficial for subsequent texturing processes.

Related R & D Team

Zhang Yuhang

Technical Director

The impact of leadership on organizations and teams is profound and lasting. A strong leader can stimulate the enthusiasm of employees, improve team cohesion, and promote the organization to achieve excellent performance. Leadership style and values will also have an important impact on the organizational culture, shaping the team's working atmosphere and value orientation.

Zhao Chenxi

Human Resources Manager

Chen Zihan

Creative Director

Li Tingting

Chief Financial Officer

Product Inquiry

Our staff will contact you within 24 hours (working days), if you need other services, please contact us

WUHAN YITAN TECHNOLOGY DEVELOPMENT CO., LTD

Telephone:+860713-5319769

Fax: 86-0713-5319719

E-mail:office@whyttech.com

Postal Code: 438400

Address: New Industrial Park, Hong'an County Economic Development Zone, Hubei Province, China

Our website uses cookies and similar technologies to personalize the advertising shown to you and to help you get the best experience on our website. For more information, see our Privacy & Cookie Policy

COOKIES

required

These cookies are necessary for basic functions such as payment. Standard cookies cannot be turned off and do not store any of your information.

analyze

These cookies collect information, such as how many people are using our site or which pages are popular, to help us improve the customer experience. Turning these cookies off will mean we can't collect information to improve your experience.

Feature

These cookies enable the website to provide enhanced functionality and personalization. They may be set by us or by third-party providers whose services we have added to our pages. If you do not allow these cookies, some or all of these services may not function properly.

advertise

These cookies help us understand what you are interested in so that we can show you relevant advertising on other websites. Turning these cookies off will mean we are unable to show you any personalized advertising.

Mail：office@whyttech.com

WhatsApp：+860713-5319769

Telephone：+860713-5319769