Products
Series Classification
Photovoltaic additives
Diamond wire cutting coolant
Cleaner
Debonding agent
Lollipop
Phosphate compound fertilizer
Wet-process phosphoric acid
Concentrated phosphoric acid
Phosphate rock reverse flotation collector
Phosphoric acid extraction defoamer
Circulating water aid agent
Scale and corrosion inhibitor
Algaecide
Oil stain cleaning agent
Defoamer
Semiconductor and Glass Plate
Wire erosion fluid
Abrasive
Cleaning agent
Padding fluid
Metalworking additives
Fully synthetic copper wire drawing fluid
Semi-synthetic copper wire drawing oil
Tinning flux
Copper wire antioxidant
Main push Products
Silicon wafer debonding agent NY-125
More details
Silicon Wafer De-bonding Agent NY-126
Silicon wafer debonding agent (NY-125/NY-126/NY-127/NY-128)
Diamond wire cutting coolant NY-426
Diamond wire cutting coolant NY-427
Diamond wire cutting coolant NY-429
This product is used in the splicing process of solar monocrystalline/multicrystalline silicon rods, for the splicing between silicon rods, reducing issues such as cracks, grinding marks, and dull blades that occur during machining. It has strong process applicability and good debonding effects, making the recovery of edge scraps simpler and more convenient.
This product has an extremely excellent separation effect on single/double component adhesives between silicon wafers and cutting resin boards, and can be effectively used for various bonding adhesives currently applied in the solar cutting industry. It is safe and convenient to operate, non-flammable, and poses no harm to the human body.
This product is suitable for the de-bonding process after the multi-wire cutting of hard and brittle materials with diamond wire. It has an extremely excellent separation effect on the two-component adhesive bonding between silicon wafers and plastic plates, especially suitable for the use of various adhesives in the multi-wire cutting of solar photovoltaic silicon wafers and semiconductor materials. It is safe and convenient to operate, non-flammable, and poses little harm to human health.
This product is suitable for cleaning native polycrystalline, head and tail materials, edge materials, fragments, etc. It can effectively remove surface metal ions, organic residue, oxidation, and other dirt, eliminating the impact on the crystal furnace. The cleaned silicon material has the advantages of a clean surface, consistent color, and easy rinsing.
This product is a new type of silicon wafer cleaner developed for cleaning silicon wafers, which can effectively reduce dirt on the surface of silicon wafers. It can efficiently and quickly remove dirt such as silicon powder, metal particles, and organic residues left on the surface of silicon wafers from wire cutting, as well as from the cutting and debonding processes. After cleaning with this product, the dirt rate on the silicon wafers is low, stability is good, the operation is simple, and the production yield is high.
