Products
Series Classification
Photovoltaic additives
Diamond wire cutting coolant
Cleaner
Debonding agent
Lollipop
Phosphate compound fertilizer
Wet-process phosphoric acid
Concentrated phosphoric acid
Phosphate rock reverse flotation collector
Phosphoric acid extraction defoamer
Circulating water aid agent
Scale and corrosion inhibitor
Algaecide
Oil stain cleaning agent
Defoamer
Semiconductor and Glass Plate
Wire erosion fluid
Abrasive
Cleaning agent
Padding fluid
Metalworking additives
Fully synthetic copper wire drawing fluid
Semi-synthetic copper wire drawing oil
Tinning flux
Copper wire antioxidant
Main push Products
Silicon wafer debonding agent NY-125
More details
Silicon Wafer De-bonding Agent NY-126
Silicon wafer debonding agent (NY-125/NY-126/NY-127/NY-128)
Diamond wire cutting coolant NY-426
Diamond wire cutting coolant NY-427
Diamond wire cutting coolant NY-429
Due to the presence of a certain amount of impurities in dilute phosphoric acid, during the concentration production process, the evaporation of water also concentrates these impurities in the dilute phosphoric acid. When their concentration exceeds their solubility, they will precipitate in a supersaturated state, leading to the deposition of scale on the heat exchangers, evaporators, acid pumps, and pipelines of the concentrated phosphoric acid production equipment, which severely affects the continuous normal operation of production and causes significant economic losses to the enterprise. This product is a specialized additive developed to solve the problem of harmful salt deposits and scaling in phosphoric acid concentration production. It effectively prevents or slows down the deposition, loosens, and reduces the adhesion of deposits formed by impurities such as potassium and sodium salts during phosphoric acid concentration production. With a certain amount of addition, it can greatly extend the continuous normal production cycle without adversely affecting the production process and its subsequent processes, making it a very effective specialized additive for phosphoric acid concentration production.
In the production of wet-process phosphoric acid, the carbonates, organic matter, and fluorine-containing compounds present in phosphate rock release a large amount of CO2 gas and HF gas when reacting with acid. These gases mix with sludge in the viscous reaction liquid and overflow. A stable foam layer forms on the liquid surface, making it difficult to eliminate mechanically. This foam not only affects the dispersion of phosphate rock and the acidolysis reaction but also hinders the evaporation of moisture and the removal of heat during the reaction process, causing the reaction temperature in the extraction tank to rise. In severe cases, foam can be carried into the tail suction system or even overflow, resulting in the loss of P2O3 and environmental pollution. The V408 series defoamers developed by our company have good acid resistance and thermal stability, with a short defoaming time and strong foam suppression ability. They are suitable for defoaming in the production of wet-process phosphoric acid and phosphorus-containing compound fertilizers, with a recommended addition amount of 0.02 to 1.0% of the P2O3 content of the phosphate rock powder (the P2O3 content is generally used to evaluate the grade of phosphate rock). For defoaming in other mineral acidolysis processes, the recommended addition amount is the same as that for wet-process phosphoric acid.
This product is suitable for single-component cooling fluids for cutting hard and brittle materials such as photovoltaic solar monocrystalline/multicrystalline silicon wafers, silicon wafers, gallium arsenide, and quartz using diamond wire. This product has excellent cooling, lubrication, wetting, dispersion, and defoaming functions. During use, it has advantages such as low diamond wire breakage rate, small cutting line bow, and low cutting rate. The processed materials have high yield rates, low TTV averages, low line scratch values, and fewer edge chipping rates, making it a high-performance, cost-effective, and environmentally friendly product.
This product is a special coolant for large circulation systems mainly used for cutting photovoltaic solar monocrystalline silicon wafers with diamond wire. The product has a high content of effective ingredients (high COD type) and strong synergistic effects among components, providing excellent cooling, lubrication, dispersion, defoaming, and cleaning functions. It is suitable for cutting large-size wafers, fine diameter diamond wires, and thin silicon wafers, especially suitable for cutting systems in the operation mode of recycling water with high COD enrichment, significantly reducing the consumption of pure water and bringing additional production gains to customers.
During the shutdown cleaning process of the phosphoric acid pipeline, a mixed acid of dilute sulfuric acid and dilute fluorosilicic acid is generally used as the cleaning solution to remove scaling in the system. These cleaning solutions, while cleaning the pipeline and equipment such as graphite heat exchangers, can also cause corrosion to the stainless steel material in the pipeline. The phosphoric acid pipeline corrosion inhibitor V730 is compounded from organic phosphonic acid, polycarboxylic acid sulfonate copolymer, copper-iron corrosion inhibitors, and film-forming substances. It can effectively slow down the corrosion of equipment by sulfuric acid and fluorosilicic acid in the cleaning solution, improving the utilization rate of the equipment.
This product is a graft copolymer of polyacrylamide, which contains a certain number of polar groups in its molecular chain. It can adsorb solid substances suspended in phosphoric acid and charged particles, bridging between particles or causing them to coagulate into larger flocs that settle down through charge neutralization. After adding a settling agent in the filtration process, the settling speed of acid residue in phosphoric acid can be accelerated, making it easier to filter phosphoric acid; adding a settling agent in the concentrated acid storage tank can reduce the residence time of concentrated acid in the tank, lower the solid content in concentrated acid, and increase the load of the device. This product is mainly used in the flotation, filtration, and settling processes in phosphate fertilizer production.
The product is a new type of room temperature phosphorite reverse flotation collector. This product introduces polar groups into modified fatty acid (soap) collectors, solving the problems of poor dispersion and high sensitivity to water temperature commonly found in reverse flotation collectors. It has good surface activity, high water solubility, and is widely applicable to the reverse flotation process of medium to low-grade phosphorite. The product features strong collecting ability, high selectivity, and economical dosage, especially showing strong selectivity for magnesium oxide in phosphorite, making it an efficient reverse flotation reagent.
In the production process of wet-process phosphoric acid, the vacuum filtration system equipment and pipelines experience varying degrees of scaling and blockage. These scaling substances are mainly composed of KzSiF6, NazSiF6, and CaSO4·2H20. Particularly, phosphate ores with high potassium and sodium content exhibit severe scaling phenomena, which greatly hinder the normal production of wet-process phosphoric acid. The anti-scaling agents, solubilizers, and synergists for wet-process phosphoric acid are synthesized through specific processes, effectively resisting the formation of easily scaling substances during the filtration and delivery processes of wet-process phosphoric acid, especially the nucleation and crystal growth of KzSiF6 and NazSiF6. They can significantly loosen and reduce the adhesion of scaling substances nearby. With a certain amount of addition, they can greatly extend the continuous normal production cycle and have no adverse effects on the wet-process phosphoric acid production process and its subsequent processes, making them a very effective anti-scaling additive.