Products
Series Classification
Photovoltaic additives
Diamond wire cutting coolant
Cleaner
Debonding agent
Lollipop
Phosphate compound fertilizer
Wet-process phosphoric acid
Concentrated phosphoric acid
Phosphate rock reverse flotation collector
Phosphoric acid extraction defoamer
Circulating water aid agent
Scale and corrosion inhibitor
Algaecide
Oil stain cleaning agent
Defoamer
Semiconductor and Glass Plate
Wire erosion fluid
Abrasive
Cleaning agent
Padding fluid
Metalworking additives
Fully synthetic copper wire drawing fluid
Semi-synthetic copper wire drawing oil
Tinning flux
Copper wire antioxidant
Main push Products
Silicon wafer debonding agent NY-125
More details
Silicon Wafer De-bonding Agent NY-126
Silicon wafer debonding agent (NY-125/NY-126/NY-127/NY-128)
Diamond wire cutting coolant NY-426
Diamond wire cutting coolant NY-427
Diamond wire cutting coolant NY-429
Add 1-3% polishing agent by volume in the dosing tank, maintaining a temperature of 70°C, and replenish 1.5 mL for each batch according to the volume of the dosing tank. The amount of polishing agent can be adjusted based on on-site usage.
Suitable for cutting materials such as glass, resin glass, optical glass, flat glass, camera lenses, eyeglass lenses, sapphire glass, magnetic materials, quartz optical products, and ceramic sheets.
In the production of wet-process phosphoric acid, the carbonates, organic matter, and fluorine-containing compounds present in phosphate rock release a large amount of CO2 gas and HF gas when reacting with acid. These gases mix with sludge in the viscous reaction liquid and overflow. A stable foam layer forms on the liquid surface, making it difficult to eliminate mechanically. This foam not only affects the dispersion of phosphate rock and the acidolysis reaction but also hinders the evaporation of moisture and the removal of heat during the reaction process, causing the reaction temperature in the extraction tank to rise. In severe cases, foam can be carried into the tail suction system or even overflow, resulting in the loss of P2O3 and environmental pollution. The V408 series defoamers developed by our company have good acid resistance and thermal stability, with a short defoaming time and strong foam suppression ability. They are suitable for defoaming in the production of wet-process phosphoric acid and phosphorus-containing compound fertilizers, with a recommended addition amount of 0.02 to 1.0% of the P2O3 content of the phosphate rock powder (the P2O3 content is generally used to evaluate the grade of phosphate rock). For defoaming in other mineral acidolysis processes, the recommended addition amount is the same as that for wet-process phosphoric acid.
This product is a special coolant for a large circulation system mainly used for multi-wire cutting of photovoltaic monocrystalline silicon wafers. The product has a high effective ingredient content (high COD type), strong synergistic effects between components, and excellent functions such as cooling, lubrication, wetting, dispersion, defoaming, and cleaning. It is suitable for cutting large-size silicon wafers, fine wire diameter diamond wires, and thin silicon wafers. NY-426 is suitable for the overflow mode cutting system of high COD enriched recycling water circulation systems, while NY-428/NY-205 is suitable for the closed cylinder mode cutting system of high COD enriched recycling water. It significantly reduces pure water consumption by over 90%, and the single consumption of cutting fluid can be reduced by more than 30%.
This product is a high-performance pure water single-cylinder coolant mainly used for multi-wire cutting of photovoltaic solar monocrystalline silicon wafers. It has extremely excellent dynamic surface tension and outstanding liquid cooling effect, suitable for cutting large Size silicon wafers, fine wire diameter diamond wires, and thin silicon wafers.
This product is suitable for single-component cooling fluids used in the diamond wire cutting of hard and brittle materials such as photovoltaic solar monocrystalline/multicrystalline silicon wafers, silicon wafers, gallium arsenide, and quartz. This product has excellent cooling, lubrication, wetting, dispersion, and defoaming functions. During use, it has advantages such as low diamond wire breakage rate, small cutting line bow, and low cutting rate. The processed materials have high yield rates, low TTV averages, low line scratch values, and fewer edge chipping rates, making it a product with excellent performance and high cost-effectiveness that is environmentally friendly.
This product is suitable for single-component cooling fluids for cutting hard and brittle materials such as photovoltaic solar monocrystalline/multicrystalline silicon wafers, silicon wafers, gallium arsenide, and quartz using diamond wire. This product has excellent cooling, lubrication, wetting, dispersion, and defoaming functions. During use, it has advantages such as low diamond wire breakage rate, small cutting line bow, and low cutting rate. The processed materials have high yield rates, low TTV averages, low line scratch values, and fewer edge chipping rates, making it a high-performance, cost-effective, and environmentally friendly product.
This product is a special coolant for large circulation systems mainly used for cutting photovoltaic solar monocrystalline silicon wafers with diamond wire. The product has a high content of effective ingredients (high COD type) and strong synergistic effects among components, providing excellent cooling, lubrication, dispersion, defoaming, and cleaning functions. It is suitable for cutting large-size wafers, fine diameter diamond wires, and thin silicon wafers, especially suitable for cutting systems in the operation mode of recycling water with high COD enrichment, significantly reducing the consumption of pure water and bringing additional production gains to customers.
This product is a single-component coolant mainly used for the diamond wire cutting of monocrystalline and polycrystalline silicon wafers in photovoltaic solar energy applications. This product has excellent liquid cooling effects, super strong silicon powder dispersion performance, outstanding lubrication effects, excellent wetting and penetration performance, and remarkable foam control in the cylinder. It is particularly suitable for pure water systems and low COD concentration enriched recycling cutting of large size silicon wafers, fine diameter diamond wires, and thin silicon wafers. The cutting process has low equipment torque load and high yield rate, making it an environmentally friendly product that provides excellent cost performance for customers.
