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This product has an extremely excellent separation effect on single/double component adhesives between silicon wafers and cutting resin boards, and can be effectively used for various bonding adhesives currently applied in the solar cutting industry. It is safe and convenient to operate, non-flammable, and poses no harm to the human body.
Key words: Degummy agent for silicon waferexcellentsilicon
This product is a single-component coolant mainly used for the diamond wire cutting of monocrystalline and polycrystalline silicon wafers in photovoltaic solar energy applications. This product has excellent liquid cooling effects, super strong silicon powder dispersion performance, outstanding lubrication effects, excellent wetting and penetration performance, and remarkable foam control in the cylinder. It is particularly suitable for pure water systems and low COD concentration enriched recycling cutting of large size silicon wafers, fine diameter diamond wires, and thin silicon wafers. The cutting process has low equipment torque load and high yield rate, making it an environmentally friendly product that provides excellent cost performance for customers.
Key words: Diamond wire cutting coolantproductexcellentsilicon
This product is a new type of silicon wafer cleaner developed for cleaning silicon wafers, which can effectively reduce dirt on the surface of silicon wafers. It can efficiently and quickly remove dirt such as silicon powder, metal particles, and organic residues left on the surface of silicon wafers from wire cutting, as well as from the cutting and debonding processes. After cleaning with this product, the dirt rate on the silicon wafers is low, stability is good, the operation is simple, and the production yield is high.
Key words: Silicon wafer cleaning agentsiliconwafer
