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This product is a new type of silicon wafer cleaner developed for cleaning silicon wafers, which can effectively reduce dirt on the surface of silicon wafers. It can efficiently and quickly remove dirt such as silicon powder, metal particles, and organic residues left on the surface of silicon wafers from wire cutting, as well as from the cutting and debonding processes. After cleaning with this product, the dirt rate on the silicon wafers is low, stability is good, the operation is simple, and the production yield is high.
Key words: Silicon wafer cleaning agentsiliconwafer
