This product is a high-performance cooling liquid mainly used for cutting large-size monocrystalline silicon wafers with diamond wire in photovoltaic solar applications. It has extremely excellent dynamic surface tension, outstanding liquid cooling effect, excellent extreme pressure lubrication capability, super strong silicon powder dispersion performance, and remarkable foam control in the cylinder. It is particularly suitable for cutting large-size silicon wafers, fine diameter diamond wires, and thin silicon wafers in a pure water system, with good control of breakage rates and extremely low cutting rates and wire jamming rates, resulting in a high yield rate. The small indicator data such as line marks, TTV, thickness variation, and edge chipping are excellent, effectively reducing the equipment load during the cutting process, and making a significant contribution to increasing production, enhancing efficiency, and reducing costs for customers as an environmentally friendly product.
Key words: Diamond wire cutting coolantexcellentproductwire
