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Tin-plated flux (S-13) is a new product composed of wetting agents, emulsifiers, high-temperature antioxidants, and adhesion promoters. This product can deeply clean the oxide layer on the surface of copper wires, reduce the interfacial tension between the substrate and solder, and achieve a uniform solder coating. At the same time, it has a high antioxidant effect, which can preferentially reduce tin oxide and reduce the generation of tin dross.
Key words: Metalworking additivessurfacesolder