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Tin-plated flux (S-13) is a new product composed of wetting agents, emulsifiers, high-temperature antioxidants, and adhesion promoters. This product can deeply clean the oxide layer on the surface of copper wires, reduce the interfacial tension between the substrate and solder, and achieve a uniform solder coating. At the same time, it has a high antioxidant effect, which can preferentially reduce tin oxide and reduce the generation of tin dross.
Key words: Metalworking additivessurfacesolder
This product is a special coolant for large circulation systems mainly used for cutting photovoltaic solar monocrystalline silicon wafers with diamond wire. The product has a high content of effective ingredients (high COD type) and strong synergistic effects among components, providing excellent cooling, lubrication, dispersion, defoaming, and cleaning functions. It is suitable for cutting large-size wafers, fine diameter diamond wires, and thin silicon wafers, especially suitable for cutting systems in the operation mode of recycling water with high COD enrichment, significantly reducing the consumption of pure water and bringing additional production gains to customers.
Key words: Phosphate compound fertilizer auxiliarieswaterproofsurface
