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This product is suitable for the grinding field of semiconductors and other optoelectronic materials. It focuses on reducing thermal stress during the manufacturing process, enhancing the suspension and dispersion effect of abrasives, lowering the friction coefficient during grinding, effectively avoiding frosting white spots during the grinding process, reducing contamination rates, improving grinding quality and flattening efficiency, and is an environmentally friendly product with very low foam, non-corrosive, and biodegradable.
Key words: Grinding fluidgrindingreducing
This product is used in the splicing process of solar monocrystalline/multicrystalline silicon rods, for the splicing between silicon rods, reducing issues such as cracks, grinding marks, and dull blades that occur during machining. It has strong process applicability and good debonding effects, making the recovery of edge scraps simpler and more convenient.
Key words: Round bar splicing gluesplicinggrinding
