This product is developed for cleaning monocrystalline silicon wafers cut by diamond wire (also suitable for cleaning polycrystalline wafers). It is divided into two components, A and B, and through an optimized formula, it has a stronger ability to clean various contaminants on the surface of silicon wafers, improving tolerance to contaminants before cleaning. It has a better ability to remove residual trace contaminants in the damage layer of the silicon wafer and in the wire seam, significantly reducing issues such as back-end texturing white spots. The surface of the cleaned silicon wafer is clean, with consistent color, and its brightness and cleanliness are superior to conventional cleaning agents. It also has advantages such as low foam, stable pH value, and easy rinsing, which is beneficial for subsequent texturing processes.
Key words: Silicon wafer cleaning agentcleaningwafers
