【Good News】Wuhan Yitian Technology Development Co., Ltd. successfully obtained a patent for a "monocrystalline silicon rod diamond wire cutting fluid"

　　According to financial news, Wuhan Yitian Technology Development Co., Ltd. successfully obtained a patent for a "monocrystalline silicon rod diamond wire cutting fluid," with the authorization announcement number CN116333804B and an application date of December 2021. This cutting fluid uses an advanced formula design, possessing excellent cooling and lubricating properties. It can reduce heat generation during the cutting process, protect the structural integrity of the silicon rod, improve the service life of the diamond wire, increase cutting efficiency, and reduce environmental impact. Cutting efficiency is improved by 30% compared to traditional cutting fluids, and environmental pollution is reduced by 50%. On October 25, 2024, the company also obtained a patent for a "high-efficiency diamond wire cutting coolant," with the authorization announcement number CN116333805B and an application date of December 2021. It features superior lubricity and oxidation resistance, strong heat dissipation, reduced tool wear rate, and is environmentally friendly and easy to use. It can be widely used in semiconductor wafer cutting and photovoltaic material processing.