Semiconductor additives

Semiconductor additive chemicals

 （1）Semiconductor wafer diamond wire multi line cutting

 Technical principles

 By uniformly consolidating diamond micro powder particles with a certain distribution density on a high-strength steel wire substrate(busbar)to form diamond wires,multiple high-speed moving diamond wires are used to drive the abrasive in the cutting fluid to cut the wafer material,or directly cut the semiconductor wafer into individual chips through the diamond abrasive particles fixed on the cutting line.

 Industry Development Status

 The application of diamond wire cutting technology in the semiconductor field is gradually becoming widespread.With the continuous development of the semiconductor industry,there is an increasing demand for precision,efficiency,and quality in wafer cutting.Diamond wire multi wire cutting technology,with its advantages of high precision,high speed,and low damage,has gradually become one of the mainstream technologies for semiconductor wafer cutting.At present,the leading enterprises in the industry have advantages in technology research and development and market share,and the market shows a certain concentration trend.

 Competitive landscape

 In the semiconductor wafer diamond wire multi wire cutting industry,there are companies such as Meichang Co.,Ltd.,Gaoce Co.,Ltd.,and Hengxing Technology.Among them,Meichang Co.,Ltd.,as a leading domestic photovoltaic diamond wire enterprise,has strong competitiveness in technology research and development and market share.These enterprises are continuously increasing their research and development investment to improve the performance and quality of diamond wire,in order to meet the strict requirements of the semiconductor industry for wafer cutting.

 Introduction to wire cutting fluid

 Function:

 ①Lubrication function:It can reduce the friction coefficient between diamond wire and wafer,reduce wear during cutting process,prevent brittle cracking,obvious scratches,wire breakage and other phenomena of silicon wafer,and reduce the surface roughness of silicon wafer.

 ②Cooling effect:It can timely remove the heat generated during the cutting process,avoid thermal damage to the wafer due to local overheating,and ensure cutting quality.

 ③Cleaning function:It has good cleaning performance and can make the processed wafer surface clean with almost no residue,which is beneficial for subsequent cleaning and velvet making processes.

 ④Suspension effect:It allows the debris and abrasives generated during the cutting process to be evenly suspended in the cutting fluid,preventing them from settling on the wafer surface or blocking the diamond wire,ensuring smooth cutting.

 Performance requirements:

 ①High lubrication:Ensure good lubrication between the diamond wire and the wafer during high-speed cutting,reducing friction and wear.

 ②Low foam property:avoid producing too much foam during the cutting process,which will affect the cutting effect and normal operation of the equipment 4.

 ③Good cooling performance:can quickly and effectively reduce the temperature of the cutting area,preventing wafer overheating.

 ④Environmental friendliness:Adopting environmentally friendly formulas that are non-toxic,harmless,and easily biodegradable,reducing pollution to the environment.

 ⑤Stability:The performance of cutting fluid can remain stable under different environmental conditions such as temperature and humidity,as well as long-term use.

 Application prospects

 The continuous development of the semiconductor industry drives demand growth:With the rapid development of emerging technologies such as 5G communication,artificial intelligence,the Internet of Things,and automotive electronics,the demand for semiconductor chips will continue to increase.This will drive the development of the semiconductor wafer manufacturing industry,thereby bringing a broader market space for diamond wire multi wire cutting technology,as this technology is one of the key processes for semiconductor wafer cutting.

 Technological progress expands application fields

 On the one hand,the diamond wire multi wire cutting technology itself is constantly improving,with cutting accuracy and efficiency constantly improving,which can meet higher requirements for semiconductor manufacturing processes;On the other hand,with the development of technology,this technology may be applied in some new fields,such as cutting of new semiconductor materials,further expanding its application prospects.

 Green environmental trends promote technological optimization

 Against the backdrop of increasing global emphasis on environmental protection,the semiconductor wafer cutting industry also needs to develop towards a green and environmentally friendly direction.This will promote the continuous optimization of diamond wire multi wire cutting technology,such as developing more environmentally friendly wire cutting fluids and improving material utilization during the cutting process,in order to reduce the impact on the environment and also meet the requirements of sustainable development in the industry.

 （2）Semiconductor wafer grinding fluid

 Industry Overview

 The semiconductor wafer grinding industry is a key link in semiconductor manufacturing,mainly providing grinding and processing services for semiconductor wafers,which is of great significance for ensuring wafer size accuracy,surface quality,and smooth subsequent processes.With the development of the semiconductor industry,the market size has been expanding year by year.In Asia,especially China,Japan,and South Korea,due to the rapid development of the semiconductor manufacturing industry,the wafer grinding market size continues to grow.

 Technical classification

 Mainly including mechanical grinding and chemical grinding.Mechanical grinding utilizes the frictional force between the grinding wheel and the wafer,and is suitable for processing large-sized wafers.It has low cost and mature technology,and can be divided into dry grinding and wet grinding.Chemical grinding removes materials through a chemical reaction between a chemical solution and the surface material of a wafer.It is suitable for wafer processing with high precision and high surface quality requirements.According to the type of chemical solution,it can be divided into alkaline grinding,acidic grinding,and composite grinding.

 Industry Status

 Currently,the global wafer grinding and cutting market is showing a steady growth trend.With the shrinking of semiconductor process nodes,the requirements for grinding accuracy,efficiency,and stability continue to increase,and technological innovation and process improvement have become the key to industry development.At the same time,leading companies in the industry such as Shin Etsu Chemical in Japan and Samsung in South Korea have continuously improved and enhanced product performance and stability through research and development.

 Introduction to Semiconductor Wafer Grinding Fluid

 Ingredients and functions

 Grinding fluid is generally composed of grinding particles,chemical additives,and solvents.Grinding particles are usually superhard materials such as diamond and silicon carbide,responsible for micro removal of wafer surfaces;Chemical additives can accelerate the grinding process,reduce surface damage,and regulate acidity and alkalinity;The solvent is used to disperse grinding particles and dissolve chemical additives,making the grinding solution have good fluidity and stability.

 Performance requirements

 Has high removal efficiency and can quickly and effectively remove wafer surface materials;Good flatness control ability ensures that the wafer surface achieves extremely high flatness;Low surface roughness reduces scratches and damage to the wafer surface;Excellent dispersibility and stability prevent agglomeration and precipitation of grinding particles;Good compatibility with grinding equipment and grinding pads;At the same time,it must also meet environmental protection requirements,be non-toxic,harmless,and easy to handle.

 Main types

 Common grinding fluids used for rough grinding have larger grinding particles and higher removal rates;There are also grinding fluids used for precision grinding and polishing,with finer particles that can achieve higher surface smoothness and accuracy.In addition,there are various special types of polishing fluids for different wafer materials and process requirements,such as copper CMP polishing fluid,barrier layer CMP polishing fluid,cobalt CMP polishing fluid,front-end CMP polishing fluid,etc.

 The application prospects of semiconductor wafer grinding

 ①In the field of semiconductor chip manufacturing:With the development of emerging technologies such as 5G,artificial intelligence,and the Internet of Things,the demand for high-performance and highly integrated chips continues to increase,driving the rapid development of the semiconductor industry and subsequently driving the growth of the wafer grinding industry.In advanced chip manufacturing processes,such as 7-nanometer and below process nodes,the precision and surface quality requirements for wafer grinding are extremely high.Wafer grinding technology will continue to innovate to meet the demand.

 ②In the field of power devices,the demand for power devices is increasing in areas such as new energy vehicles,industrial control,and photovoltaic power generation.Power devices usually need to be manufactured on large-sized wafers,with strict requirements for wafer flatness,thickness uniformity,etc.,which provides a broad market space for the wafer grinding industry.

 ③In the field of emerging semiconductor materials,third-generation semiconductor materials such as silicon carbide and gallium nitride have advantages such as high breakdown electric field and high electron mobility,and have broad application prospects in 5G communication,new energy vehicles,aerospace and other fields.These materials have high hardness and difficulty in processing,which puts higher demands on grinding technology and grinding fluid performance,and also prompts the wafer grinding industry to continuously develop new technologies and products to meet the processing needs of emerging semiconductor materials.

 ④In the field of 3D integrated chips,3D integrated chip technology is one of the important directions for the future development of semiconductors.It achieves higher integration and performance by stacking multiple chip layers together.In the manufacturing process of 3D integrated chips,high-precision grinding and polishing of wafers are required to ensure good connections and electrical performance between chip layers,which will bring new development opportunities to the wafer grinding industry.

 The Development Direction of Future Semiconductor Wafer Grinding Fluid

 ①Higher precision and surface quality:As the size of semiconductor devices continues to shrink,the requirements for the flatness,roughness,and accuracy of wafer surfaces are becoming increasingly high.Grinding fluid needs to have more precise particle size distribution and better grinding performance to achieve surface processing at the nanometer level or even higher precision,ensuring that the wafer surface is scratch free and defect free,and meeting the requirements of advanced process nodes.

 ②Adapting to new wafer materials:The application of third-generation semiconductor materials such as silicon carbide,gallium nitride,and other new semiconductor materials is becoming increasingly widespread.These materials have characteristics such as high hardness and chemical stability,making them difficult to process.Therefore,it is necessary to develop grinding fluids specifically for these new materials,optimize abrasive types,formulations,and additives to improve grinding efficiency and quality,and reduce processing costs.

 ③Green and environmentally friendly:Against the backdrop of increasingly strict environmental requirements,the green development of grinding fluids has become an inevitable trend.Future grinding fluids will increasingly use biodegradable,non-toxic,and harmless raw materials to reduce environmental pollution and harm to human health.At the same time,the production process of grinding fluid will also pay more attention to energy conservation and emission reduction,and improve resource utilization efficiency.

 ④Intelligence and automation:With the advancement of intelligent manufacturing in the semiconductor industry,the supply and management of grinding fluid will develop towards intelligence and automation.For example,through online monitoring and feedback control systems,key parameters such as the composition,concentration,and particle size of the grinding fluid can be monitored in real time and automatically adjusted and optimized to ensure the stability and consistency of the grinding process,improve production efficiency and product yield.

 ⑤Customized services:Different semiconductor manufacturing processes and wafer products have varying performance requirements for grinding fluids.In the future,abrasive suppliers will pay more attention to providing customized solutions for customers,developing personalized abrasive products based on their specific needs,and meeting the processing requirements of specific processes and products.

 ⑥Improving grinding efficiency:In order to meet the large-scale production needs of the semiconductor industry,grinding fluid needs to improve grinding efficiency,shorten processing time,and reduce production costs while ensuring grinding quality.This may be achieved through improving the performance of abrasives,optimizing formulations,and developing new grinding technologies.

 ⑦Integration with new equipment and processes:With the continuous innovation of semiconductor manufacturing equipment and processes,such as the emergence of new grinding equipment and the application of new grinding processes,grinding fluids need to be adapted and integrated to achieve collaborative optimization of equipment,processes,and grinding fluids,in order to achieve the best grinding effect and production efficiency.

 （3）Semiconductor wafer cleaning agent

 Semiconductor wafer cleaning agent is a key chemical used in the semiconductor manufacturing process to remove impurities and pollutants from the wafer surface.Here is a detailed introduction about it:

 Function

 Removing particle impurities:It can effectively remove dust,metal particles,etc.adsorbed on the wafer surface during the manufacturing process.If these particles are not removed,they may cause chip short circuits or other performance problems.

 Removing organic residues:Organic substances such as photoresist and release agents used in semiconductor manufacturing need to be thoroughly removed with cleaning agents to avoid affecting subsequent processes and chip performance.

 Removing metal ions:preventing metal ions from forming compounds on the wafer surface,avoiding adverse effects on the electrical performance of semiconductor devices,such as reducing carrier mobility.

 Surface modification:Some cleaning agents can also perform slight etching or modification on the wafer surface to improve the chemical properties and roughness of the wafer surface,and enhance the quality of subsequent thin film deposition,photolithography,and other processes.

 Classification

 Acidic cleaning agents:Common single acid or mixed acid systems include sulfuric acid,hydrochloric acid,nitric acid,etc.For example,sulfuric acid hydrogen peroxide mixture(SPM)has strong oxidizing and acidic properties,and can effectively remove organic matter and some metal impurities.Acidic cleaning agents are mainly used to remove metal oxides,organic compounds,and some alkaline impurities from the surface of wafers.

 Alkaline cleaning agent:mainly composed of strong alkalis such as potassium hydroxide and sodium hydroxide,and usually supplemented with some surfactants,chelating agents,and other auxiliary ingredients.Potassium hydroxide ethanol solution can be used to remove organic substances such as photoresist on the surface of wafers.Alkaline cleaning agents have a good effect on removing organic matter and some particulate impurities,while causing minimal damage to the wafer surface.

 Neutral cleaning agent:Its pH value is close to 7,generally composed of non-ionic surfactants,chelating agents,corrosion inhibitors,etc.Neutral cleaning agents have the characteristics of mild and low corrosion,suitable for wafer materials or process steps that are sensitive to acid and alkali.They can effectively remove particles and organic matter without causing chemical damage to the wafer surface.

 Performance requirements

 High cleaning capability:capable of quickly and thoroughly removing various impurities,ensuring that the wafer surface meets extremely high cleanliness requirements.

 Low corrosiveness:To avoid corrosion or damage to wafer materials,metal electrodes,and other device structures,ensuring the integrity and performance of the wafer.

 Good compatibility:Compatible with other process chemicals,materials,and equipment in semiconductor manufacturing,without causing adverse reactions or affecting subsequent processes.

 Easy to clean:After cleaning,it can be easily rinsed with deionized water without leaving any impurities or cleaning agents,preventing secondary contamination of the wafer.

 Environmental friendliness:Meet environmental requirements,minimize pollution to the environment,and its components should be easy to handle and discharge.

 Development Trends

 Green and environmentally friendly:With the increasing awareness of environmental protection,the development of more environmentally friendly cleaning agents is a trend.This includes using biodegradable ingredients,reducing emissions of volatile organic compounds(VOCs),and lowering the difficulty of wastewater treatment.

 High precision cleaning:With the continuous reduction of semiconductor device size,the requirements for cleaning accuracy are becoming increasingly high.Cleaning agents need to be able to remove smaller particles and impurities while ensuring that the flatness and roughness of the wafer surface are not affected.

 Multi functional integration:Future cleaning agents may integrate multiple functions,such as surface modification and oxidation resistance while cleaning,to reduce process steps and improve production efficiency.

 Customized services:Provide customized cleaning solutions based on different wafer materials,process requirements,and customer needs to meet specific cleaning needs.

 （4）Slicing solution

 Wafer cutting solution is a key auxiliary material used in semiconductor manufacturing to cut wafers into individual chips.Here is a detailed introduction about it:

 Function

 Lubrication and cooling:During the cutting process,the cutting fluid can effectively reduce the friction between the cutting tool and the wafer,reduce heat generation,prevent damage to the wafer due to overheating,and also extend the service life of the cutting tool.

 Protecting the wafer surface:Its components can form a protective film on the wafer surface to prevent mechanical and thermal stresses generated during the cutting process from damaging the wafer surface,ensuring the performance and reliability of the chip.

 Removing impurities:It can promptly wash away impurities such as silicon powder and metal shavings generated during cutting,preventing impurities from adhering to the wafer surface or entering the cutting gap,affecting cutting quality and chip performance.

 Market situation

 Scale growth:With the development of the global semiconductor industry,especially the transfer of the industry to China and the vigorous development of the domestic electronic equipment manufacturing industry,the scale of China's wafer cutting solution market has achieved stable growth.The global market size is also constantly expanding,and it is predicted to grow at a certain compound annual growth rate from 2023 to 2030.

 Competitive landscape:Internationally,giants such as DuPont,Lam Research,and Applied Materials dominate.In China,local enterprises such as Jiangfeng Electronics and Northern Huachuang are gradually developing,and market competition is becoming increasingly fierce.

 Development Trends

 Technological innovation:With the development of semiconductor technology towards higher integration and more complex structures,the wafer cutting liquid industry is undergoing a transformation from low-end to high-end,from imitation to independent innovation.Enterprises are constantly developing high-performance and environmentally friendly products.

 Environmental requirements have increased:With stricter environmental regulations,the demand for green and environmentally friendly wafer cutting liquids has increased,prompting companies to pay more attention to environmental performance in product development and production processes.

 Adapting to emerging applications:The rise of emerging industries such as 5G,artificial intelligence,and the Internet of Things is driving the growth of the integrated circuit industry.The performance requirements for wafer cutting liquids are becoming more diversified,which will drive continuous innovation in product types and technologies.

 （5）Laser cutting protective fluid

 Wafer laser cutting protective liquid is a key auxiliary material used in the wafer laser cutting process.The following is a detailed introduction for you:

 Function

 Protecting the wafer surface:A protective film is formed during cutting to prevent the cutting tool from scratching the wafer surface,avoiding problems such as cracks,edge breakage,and surface scratches,while also preventing the metal lines on the chip surface from being oxidized at high temperatures.

 Reduce thermal effects:It has good heat dissipation,heat resistance,and cooling functions,which can timely disperse the heat generated by laser cutting,prevent the diffusion of heat energy,reduce the heat affected zone,avoid cutting too large,and prevent the protective film from being thermally fixed.

 Pollution prevention:Effectively prevent cutting debris from splashing onto the wafer surface,avoid lens damage caused by splashing and dust adhesion,while suppressing static electricity and reducing dust adsorption.