Photovoltaic chemical additives

Photovoltaic chemical additives

　　Each production link in the photovoltaic solar energy industry chain cannot do without auxiliary chemicals.For example,we can provide silicon cleaning agents for the silicon material end,silicon rod splicing adhesive and cutting fluid for the silicon rod cutting end,silicon rod bonding adhesive,diamond wire cutting cooling fluid,debonding agent,cleaning agent for the silicon wafer processing end,and velvet additives for the battery cell end.

　　（1）Diamond wire cutting coolant

　　Silicon wafer diamond wire cutting needs to balance cutting efficiency,silicon wafer quality,and environmental requirements.The following is a complete solution for core chemicals:

　　Diamond wire cutting fluid for photovoltaic silicon wafers is mainly used in the cutting process of photovoltaic silicon wafers.The following is its specific introduction:

　　Cutting effect

　　①Suspension and dispersion of silicon carbide particles:It can effectively suspend silicon carbide particles,making them more evenly distributed in the cutting fluid,improving cutting efficiency,and reducing cutting consumption.

　　②Lubrication of silicon wafer surface:A protective film is formed on the surface of the silicon wafer to reduce cutting resistance,ensure smooth surface of the cut product,and reduce scratches and damage.

　　③Cooling cutting process:effectively dissipate heat,reduce cutting stress,avoid problems such as silicon wafer deformation and brittleness caused by high temperature,and improve the quality and yield of silicon wafers.

　　Industry advantages

　　①Improving cutting quality:It can reduce the roughness of the processed surface,improve surface smoothness,make the silicon wafer surface smoother,reduce processing errors,improve processing accuracy and repeatability,and help meet the high requirements of the photovoltaic industry for silicon wafer quality.

　　②Reducing processing costs:It can reduce the wear and damage of diamond wire,extend its service life,and thus reduce the frequency and cost of diamond wire replacement.In addition,the cutting fluid itself has the characteristics of high concentration ratio and low addition amount,resulting in lower usage costs.

　　③Good environmental performance:It is usually a water-based cutting fluid that does not contain halogens,organic silicon defoamers,or other harmful substances.It is harmless to human health and the environment,and can be cleaned with water without using organic solvents.It has good environmental protection and recyclability.

　　Scope of application

　　④Suitable for diamond wire cutting processing of various hard and brittle materials such as monocrystalline silicon,polycrystalline silicon,semiconductors,wafers,chips,sapphires,ceramics,etc.,meeting the cutting needs of different materials and processes.With the continuous development of the photovoltaic industry,the demand for silicon wafers continues to increase,and the application of diamond wire cutting fluid for photovoltaic silicon wafers is becoming increasingly widespread in the industry.

　　The development prospects of diamond wire cutting fluid for photovoltaic silicon wafers are relatively broad,mainly reflected in the following aspects:

　　Market size growth

　　With the increasing global demand for clean energy,the photovoltaic industry is developing rapidly,driving the growth of silicon wafer production and continuously expanding the market size of silicon wafer cutting fluid.According to statistics,the global silicon wafer cutting fluid market will grow from 663 million US dollars in 2016 to 795 million US dollars in 2024,and is expected to reach 926 million US dollars by 2025.The same goes for the Chinese market.In 2024,the market size of silicon wafer cutting fluid in China was 767 million yuan,of which the market size of silicon wafer diamond wire cutting fluid was 718 million yuan.It is expected that the market size of silicon wafer cutting fluid will be about 889 million yuan and the market size of silicon wafer diamond wire cutting fluid will be about 832 million yuan by 2025.

　　Driven by technological innovation

　　①Environmental Protection:With increasingly strict environmental requirements,the development of more environmentally friendly cutting fluids has become a trend.The new cutting fluid will reduce the use of harmful components,lower environmental pollution and harm to human health,and also facilitate subsequent wastewater treatment and resource recovery.

　　②Functional compounding:In order to meet the high-precision and high-efficiency requirements of silicon wafer cutting,the cutting fluid will have more composite functions,such as better lubrication,cooling,cleaning,and dispersion,to improve cutting quality and efficiency and reduce cutting costs.

　　③Recycling:By improving recycling technology and increasing the recycling rate of cutting fluid,it can not only reduce production costs for enterprises,but also reduce resource waste and environmental pollution.

　　Industry development promotion

　　The trend towards larger and thinner silicon wafers has put forward higher requirements for the performance of cutting fluids,prompting enterprises to increase research and development investment,promote continuous progress in cutting fluid technology,and bring new growth opportunities to the cutting fluid market.

　　Expansion of application areas

　　In addition to the field of photovoltaic silicon wafer cutting,diamond wire cutting fluid is also widely used in the cutting and processing of hard and brittle materials such as semiconductors,sapphires,and ceramics.With the continuous development of these industries,the application areas of cutting fluids will further expand,and market demand will correspondingly increase.

　　In short,the chemical solution for diamond wire cutting needs to be centered around"efficient cutting+green recycling",achieving a balance between cutting efficiency(single equipment daily production capacity>3000 pieces)and environmental benefits through refined formulation,intelligent process,and resource recycling.The future trend will focus on phosphorus and nitrogen free formulas,bio based lubricants,and full process digital management.

　　（2）Silicon wafer cleaning agent

　　Product Introduction

　　Mainly used in the upstream silicon wafer manufacturing process of the photovoltaic industry,after silicon rod cutting,it is used to remove cutting fluid residues,silicon powder,dust particles,metal impurities and other pollutants on the surface of the silicon wafer,ensuring the cleanliness of the silicon wafer and providing a good foundation for subsequent production processes such as velvet making,diffusion,etching,etc.,in order to improve the photoelectric conversion efficiency of the solar cell.

　　Product Features

　　①Low residue

　　②Good material compatibility

　　③Strong cleaning ability

　　④Good chemical stability

　　⑤Green and environmentally friendly

　　Application advantages

　　The use of photovoltaic silicon wafer cleaning agents can effectively improve the yield of silicon wafer production,reduce the impact of surface impurities on subsequent processes,enhance the performance and quality of solar cells,thereby improving the power generation efficiency and reliability of the entire photovoltaic module and reducing production costs.

　　In short,photovoltaic silicon wafer cleaning agents are indispensable auxiliary materials in the photovoltaic industry.With the continuous development of the photovoltaic industry,the requirements for their performance and quality are also constantly increasing.

　　（3）Silicon wafer debonding agent

　　Product Introduction

　　Mainly used in the debonding process of silicon rods after cutting in the production of photovoltaic silicon wafers.After the silicon rod is cut,the silicon wafer is fixed on the carrier with glue.A debonding agent is needed to soften and break the glue,so that the silicon wafer can smoothly fall off from the carrier for subsequent cleaning,velvet making and other processing steps.

　　Product Features

　　High degumming efficiency,compared to traditional pure lactic acid degumming agents,can achieve good degumming effect in a shorter time.Widely applicable and adaptable to various adhesive systems and debonding conditions,it can meet complex and diverse colloid types and process requirements.In addition,it also has good wetting and permeability,which can solve the problem of abnormal delamination of narrow slit and small chamfered silicon wafers,while reducing the heavy wafer rate and fragment rate during silicon wafer layout.

　　Industry application advantages

　　The use of photovoltaic silicon wafer debonding agents can improve debonding efficiency,reduce debonding time and cost,and enhance the overall production capacity of silicon wafer.At the same time,it can reduce the damage rate and failure rate of silicon wafers,improve the quality of silicon wafers,and provide guarantees for the subsequent production of high-quality photovoltaic cells and modules.