This product is suitable for single-component cooling fluids for cutting hard and brittle materials such as photovoltaic solar monocrystalline/multicrystalline silicon wafers, silicon wafers, gallium arsenide, and quartz using diamond wire. This product has excellent cooling, lubrication, wetting, dispersion, and defoaming functions. During use, it has advantages such as low diamond wire breakage rate, small cutting line bow, and low cutting rate. The processed materials have high yield rates, low TTV averages, low line scratch values, and fewer edge chipping rates, making it a high-performance, cost-effective, and environmentally friendly product.
Key words: Phosphate compound fertilizer auxiliariesreinforcementtreatment
