This product is suitable for single-component cooling fluids used in the diamond wire cutting of hard and brittle materials such as photovoltaic solar monocrystalline/multicrystalline silicon wafers, silicon wafers, gallium arsenide, and quartz. This product has excellent cooling, lubrication, wetting, dispersion, and defoaming functions. During use, it has advantages such as low diamond wire breakage rate, small cutting line bow, and low cutting rate. The processed materials have high yield rates, low TTV averages, low line scratch values, and fewer edge chipping rates, making it a product with excellent performance and high cost-effectiveness that is environmentally friendly.
Key words: Diamond wire cutting coolantlowperformance
