Technological development direction - the development direction of slicing technology
Release time:
2023-11-20
Summary: Narrowing of busbar diameter - breaking force

Thinning Narrowing of busbar diameter - breaking force Few diamond particles in cross-section - cutting force The smaller the particle size of silicon powder during cutting - dispersion force | High line speed High requirements for wire tension Higher frictional heat | Large size The degree of steel wire wear has intensified Increased concentration of silicon powder | Thinning The degree of steel wire wear has intensified High concentration of silicon powder |