Technological development direction - the development direction of slicing technology


Release time:

2023-11-20

Summary: Narrowing of busbar diameter - breaking force

解决方案

Thinning

Narrowing of busbar diameter - breaking force

Few diamond particles in cross-section - cutting force

The smaller the particle size of silicon powder during cutting - dispersion force

High line speed

High requirements for wire tension

Higher frictional heat

Large size

The degree of steel wire wear has intensified

Increased concentration of silicon powder

Thinning

The degree of steel wire wear has intensified

High concentration of silicon powder