Difficulties in the cutting process of M12 silicon wafers
Release time:
2023-11-20
Summary： High concentration of silicon powder is generated, which is prone to dirt and stains M12 has a 60% increase in silicon powder content in the cylinder body compared to M6 M12 has a 33% increase in silicon powder content compared to M10 in the cylinder block
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High concentration of silicon powder is generated, which is prone to dirt and stains M12 has a 60% increase in silicon powder content in the cylinder body compared to M6 M12 has a 33% increase in silicon powder content compared to M10 in the cylinder block |
Large circulating flow, foam high overflow cylinder Circulating spray flow rate 200-250L/min 20% -50% higher than M6 cutting circulation flow rate |
The cutting belt has a long liquid travel, with broken wires and broken edges M12 has a 26.5% increase in liquid travel compared to M6 M12 has a 15.4% increase in liquid travel compared to M10 |
High lifting torque Shutdown, wire breakage, surface scratches |
